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  ? 2003 microchip technology inc. ds21422b-page 1 m tc4426/TC4427/tc4428 features ? high peak output current ? 1.5a ? wide input supply voltage operating range: - 4.5v to 18v ? high capacitive load drive capability ? 1000 pf in 25 nsec (typ.) ? short delay times ? 40 nsec (typ.) ? matched rise and fall times ? low supply current: - with logic ? 1 ? input ? 4 ma - with logic ? 0 ? input ? 400 a ? low output impedance ? 7 ? ? latch-up protected: will withstand 0.5a reverse current ? input will withstand negative inputs up to 5v ? esd protected ? 4 kv ? pinouts same as tc426/tc427/tc428 applications ? switch mode power supplies ? line drivers ? pulse transformer drive general description the tc4426/TC4427/tc4428 are improved versions of the earlier tc426/tc427/tc428 family of mosfet drivers. the tc4426/TC4427/tc4428 devices have matched rise and fall times when charging and dis- charging the gate of a mosfet. these devices are highly latch-up resistant under any conditions within their power and voltage ratings. they are not subject to damage when up to 5v of noise spik- ing (of either polarity) occurs on the ground pin. they can accept, without damage or logic upset, up to 500 ma of reverse current (of either polarity) being forced back into their outputs. all terminals are fully protected against electrostatic discharge (esd) up to 4kv. the tc4426/TC4427/tc4428 mosfet drivers can easily charge/discharge 1000 pf gate capacitances in under 30 nsec and provide low enough impedances in both the ?on? and ?off? states to ensure the mosfet's intended state will not be affected, even by large transients. other compatible drivers are the tc4426a/TC4427a/ tc4428a family of devices. the tc4426a/TC4427a/ tc4428a devices have matched leading and falling edge input-to-output delay times, in addition to the matched rise and fall times of the tc4426/TC4427/ tc4428 devices. package types 8-pin soic/msop/pdip/cerdip 1 2 3 4 nc 5 6 7 8 out a out b nc in a gnd in b v dd tc4426 nc = no connection 2,4 7,5 inverting 2 7 complementary 4 5 2,4 7,5 non-inverting 1 2 3 4 nc 5 6 7 8 out a out b nc in a gnd in b v dd TC4427 1 2 3 4 nc 5 6 7 8 out a out b nc in a gnd in b v dd tc4428 1.5a dual high-speed power mosfet drivers
tc4426/TC4427/tc4428 ds21422b-page 2 ? 2003 microchip technology inc. functional block diagram effective input c = 12 pf (each input) tc4426/TC4427/tc4428 output input gnd v dd 300 mv 4.7v inverting non-inverting note 1: tc4426 has two inverting drivers; TC4427 has two non-inverting drivers; tc4428 has one inverting and one non-inverting driver. 2: ground any unused driver input.
? 2003 microchip technology inc. ds21422b-page 3 tc4426/TC4427/tc4428 1.0 electrical characteristics absolute maximum ratings ? supply voltage .....................................................+22v input voltage, in a or in b ................................. (v dd + 0.3v) to (gnd ? 5v) package power dissipation (t a 70c) pdip........................................................ 730 mw cerdip .................................................. 800 mw msop ..................................................... 340 mw soic ....................................................... 470 mw storage temperature range.............. -65c to +150c maximum junction temperature ...................... +150c ? stresses above those listed under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. pin function table dc characteristics name function nc no connection in a input a gnd ground in b input b out b output b v dd supply input out a output a nc no connection electrical specifications: unless otherwise noted, t a = +25oc with 4.5v v dd 18v. parameters sym min typ max units conditions input logic ? 1 ?, high input voltage v ih 2.4 ? ? v note 2 logic ? 0 ?, low input voltage v il ??0.8v input current i in -1.0 ? +1.0 a 0v v in v dd output high output voltage v oh v dd ? 0.025 ? ? v dc test low output voltage v ol ? ? 0.025 v dc test output resistance r o ?710 ? i out = 10 ma, v dd = 18v peak output current i pk ?1.5?av dd = 18v latch-up protection withstand reverse current i rev ? >0.5 ? a duty cycle 2%, t 300 sec v dd = 18v switching time (note 1) rise time t r ?1930nsec figure 4-1 fall time t f ?2530nsec figure 4-1 delay time t d1 ?2030nsec figure 4-1 delay time t d2 ?4050nsec figure 4-1 power supply power supply current i s ? ? ? ? 4.5 0.4 ma v in = 3v (both inputs) v in = 0v (both inputs) note 1: switching times ensured by design. 2: for v temperature range devices, the v ih (min) limit is 2.0v.
tc4426/TC4427/tc4428 ds21422b-page 4 ? 2003 microchip technology inc. dc characteristics (over operating temperature range) temperature characteristics electrical specifications: unless otherwise noted, over operating temperature range with 4.5v v dd 18v. parameters sym min typ max units conditions input logic ? 1 ?, high input voltage v ih 2.4 ? ? v note 2 logic ? 0 ?, low input voltage v il ??0.8v input current i in -10 ? +10 a 0v v in v dd output high output voltage v oh v dd ? 0.025 ? ? v dc test low output voltage v ol ? ? 0.025 v dc test output resistance r o ?912 ? i out = 10 ma, v dd = 18v peak output current i pk ?1.5?av dd = 18v latch-up protection withstand reverse current i rev ? >0.5 ? a duty cycle 2%, t 300 sec v dd = 18v switching time (note 1) rise time t r ? ? 40 nsec figure 4-1 fall time t f ? ? 40 nsec figure 4-1 delay time t d1 ? ? 40 nsec figure 4-1 delay time t d2 ? ? 60 nsec figure 4-1 power supply power supply current i s ? ? ? ? 8.0 0.6 ma v in = 3v (both inputs) v in = 0v (both inputs) note 1: switching times ensured by design. 2: for v temperature range devices, the v ih (min) limit is 2.0v. electrical specifications: unless otherwise noted, all parameters apply with 4.5v v dd 18v. parameters sym min typ max units conditions temperature ranges specified temperature range (c) t a 0?+70oc specified temperature range (e) t a -40 ? +85 oc specified temperature range (v) t a -40 ? +125 oc specified temperature range (m) t a -55 ? +125 oc maximum junction temperature t j ??+150oc storage temperature range t a -65 ? +150 oc package thermal resistances thermal resistance, 8l-msop ja ?206?oc/w thermal resistance, 8l-soic ja ?155?oc/w thermal resistance, 8l-pdip ja ?125?oc/w thermal resistance, 8l-cerdip ja ?150?oc/w
? 2003 microchip technology inc. ds21422b-page 5 tc4426/TC4427/tc4428 2.0 typical performance curves note: unless otherwise indicated, t a = +25oc with 4.5v v dd 18v. figure 2-1: rise time vs. supply voltage. figure 2-2: rise time vs. capacitive load. figure 2-3: rise and fall times vs. temperature. figure 2-4: fall time vs. supply voltage. figure 2-5: fall time vs. capacitive load. figure 2-6: propagation delay time vs. supply voltage. note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. the performance characteristics listed herein are not tested or guaranteed. in some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. t rise (nsec) 4681012 14 16 18 100 pf 470 pf 2200 pf 1500 pf 100 1000 pf 80 60 40 20 0 v dd (v) 100 1000 10,000 c (pf) load 5v 10v 15v 100 80 60 40 20 0 t rise (nsec) time (nsec) t rise temperature ( ?c ) c = 1000 pf load v = 17.5v dd 60 ?5 ?5 5 25 45 65 85 105 125 ?5 t fall 50 40 30 20 10 t fall (nsec) 4681012 14 16 18 100 pf 470 pf 1000 pf 2200 pf 1500 pf 100 80 60 40 20 0 v dd (v) 100 1000 10,000 5v 10v c (pf) load 100 80 60 40 20 0 t fall (nsec) 15v 20 25 30 35 40 45 50 55 60 65 70 75 80 4 6 8 1012141618 v dd (v) propagation delay (nsec) t d1 t d2 c load = 1000pf v in = 5v
tc4426/TC4427/tc4428 ds21422b-page 6 ? 2003 microchip technology inc. note: unless otherwise indicated, t a = +25oc with 4.5v v dd 18v. figure 2-7: propagation delay time vs. input amplitude. figure 2-8: supply current vs. supply voltage. figure 2-9: output resistance (r oh ) vs. supply voltage. figure 2-10: propagation delay time vs. temperature. figure 2-11: supply current vs. temperature. figure 2-12: output resistance (r ol ) vs. supply voltage. 10 15 20 25 30 35 40 45 50 55 60 0123456789101112 input amplitude (v) propagation delay (nsec) t d1 t d2 c load = 1000pf v dd = 12v 4 i (ma) quiescent 18 6 8 10 12 14 16 0.1 both inputs = 1 both inputs = 0 v dd 1 4681012 14 16 18 v dd r ds(on) ( ? ) 20 25 15 10 8 5 worst case @ t j = +150 c typ @ t a = +25 c 10 15 20 25 30 35 40 45 -55 -35 -15 5 25 45 65 85 105 125 temperature (oc) delay time (nsec) t d1 t d2 c load = 1000 pf v in = 5v v dd = 18v t a ( c) i quiescent (ma) 4.0 3.5 3.0 2.5 2.0 ?5 35 ?5 5 25 45 65 85 105 125 v = 18v dd both inputs = 1 4681012 14 16 1 8 20 v dd 25 15 10 8 5 worst case @ t j = +150 c typ @ t a = +25 c r ds(on) ( ? )
? 2003 microchip technology inc. ds21422b-page 7 tc4426/TC4427/tc4428 note: unless otherwise indicated, t a = +25oc with 4.5v v dd 18v. figure 2-13: supply current vs. capacitive load. figure 2-14: supply current vs. capacitive load. figure 2-15: supply current vs. capacitive load. figure 2-16: supply current vs. frequency. figure 2-17: supply current vs. frequency. figure 2-18: supply current vs. frequency. 60 100 1000 10,000 i supply (ma) 2 mhz 600 khz 200 khz 20 khz 900 khz c (pf) load v = 18v dd 50 40 30 20 10 0 100 1000 10,000 2 mhz 600 khz 200 khz 20 khz 900 khz v = 12v dd c (pf) load 60 50 40 30 20 10 0 i supply (ma) 100 1000 10,000 2 mhz 200 khz 20 khz 600 khz 900 khz v = 6v dd c (pf) load 60 50 40 30 20 10 0 i supply (ma) 10 100 1000 frequency ( khz ) 1000 pf 2200 pf v = 18v dd 100 pf 60 50 40 30 20 10 0 i supply (ma) 10 100 1000 frequency (khz) 1000 pf 2200 pf 100 pf v = 12v dd 60 50 40 30 20 10 0 i supply (ma) 10 100 1000 frequency ( khz ) 1000 pf 2200 pf 100 pf v = 6v dd 60 50 40 30 20 10 0 i supply (ma)
tc4426/TC4427/tc4428 ds21422b-page 8 ? 2003 microchip technology inc. note: unless otherwise indicated, t a = +25oc with 4.5v v dd 18v. figure 2-19: crossover energy vs. supply voltage. note: the values seen in this graph represent the loss seen by both drivers in a package during one complete cycle. for a single driver, divide the stated values by 2. for a single transition of a single driver, divide the stated value by 4. 4 a ?sec 18 6 8 10 12 14 16 8 7 6 5 4 3 2 10 ? 10 ? 9 v dd
? 2003 microchip technology inc. ds21422b-page 9 tc4426/TC4427/tc4428 3.0 pin descriptions the descriptions of the pins are listed in table 3-1. table 3-1: pin function table 3.1 inputs a & b mosfet driver inputs a & b are high-impedance, ttl/cmos compatible inputs. these inputs also have 300 mv of hysteresis between the high and low thresholds that prevents output glitching even when the rise and fall time of the input signal is very slow. 3.2 ground (gnd) ground. 3.3 output a & b mosfet driver outputs a & b are low-impedance, cmos push-pull style outputs. the pull-down and pull- up devices are equal strength, making the rise and fall times equivalent. 3.4 supply input (v dd ) the v dd input is the bias supply for the mosfet driver and is rated for 4.5v to 18v with respect to the ground pin. the v dd input should be bypassed with local ceramic capacitors. the value of these capacitors should be chosen based on the capacitive load that is being driven. a value of 1.0 f is suggested. pin no. symbol description 1 nc no connection 2 in a input a 3 gnd ground 4 in b input b 5 out b output b 6v dd supply input 7 out a output a 8 nc no connection
tc4426/TC4427/tc4428 ds21422b-page 10 ? 2003 microchip technology inc. 4.0 applications information figure 4-1: switching time test circuit. c l = 1000 pf 0.1 f 4.7 f inverting driver non-inverting driver input v dd = 18v input output t d1 t f t r t d2 input: 100 khz, square wave, t rise = t fall 10 nsec output input output t d1 t f t r t d2 +5v 10% 90% 10% 90% 10% 90% v dd 0v 90% 10% 10% 10% 90% +5v v dd 0v 0v 0v 90% 3 2 7 6 4 5
? 2003 microchip technology inc. ds21422b-page 11 tc4426/TC4427/tc4428 5.0 packaging information 5.1 package marking information xxxxxxxx xxxxxnnn yyww 8-lead pdip (300 mil) example: 8-lead cerdip (300 mil) example: tc4426 cpa057 0346 xxxxxxxx xxxxxnnn yyww TC4427 mja057 0346 8-lead soic (150 mil) example: xxxxxxxx xxxxyyww nnn tc4428 coa0346 057 8-lead msop example: xxxxx ywwnnn 4427c 346057 legend: xx...x customer specific information* y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * standard device marking consists of microchip part number, year code, week code, and traceability code..
tc4426/TC4427/tc4428 ds21422b-page 12 ? 2003 microchip technology inc. 8-lead plastic dual in-line (p) ? 300 mil (pdip) b1 b a1 a l a2 p e eb c e1 n d 1 2 units inches* millimeters dimension limits min nom max min nom max number of pins n 88 pitch p .100 2.54 top to seating plane a .140 .155 .170 3.56 3.94 4.32 molded package thickness a2 .115 .130 .145 2.92 3.30 3.68 base to seating plane a1 .015 0.38 shoulder to shoulder width e .300 .313 .325 7.62 7.94 8.26 molded package width e1 .240 .250 .260 6.10 6.35 6.60 overall length d .360 .373 .385 9.14 9.46 9.78 tip to seating plane l .125 .130 .135 3.18 3.30 3.43 lead thickness c .008 .012 .015 0.20 0.29 0.38 upper lead width b1 .045 .058 .070 1.14 1.46 1.78 lower lead width b .014 .018 .022 0.36 0.46 0.56 overall row spacing eb .310 .370 .430 7.87 9.40 10.92 mold draft angle top 51015 51015 mold draft angle bottom 51015 51015 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed jedec equivalent: ms-001 drawing no. c04-018 .010? (0.254mm) per side. significant characteristic
? 2003 microchip technology inc. ds21422b-page 13 tc4426/TC4427/tc4428 8-lead ceramic dual in-line ? 300 mil (cerdip) 10.16 9.15 8.13 .400 .360 .320 eb overall row spacing 0.51 0.46 0.41 .020 .018 .016 b lower lead width 1.65 1.40 1.14 .065 .055 .045 b1 upper lead width 0.38 0.29 0.20 .015 .012 .008 c lead thickness 5.08 4.13 3.18 .200 .163 .125 l tip to seating plane 10.16 9.78 9.40 .400 .385 .370 d overall length 7.62 6.73 5.84 .300 .265 .230 e1 ceramic pkg. width 8.13 7.75 7.37 .320 .305 .290 e shoulder to shoulder width 1.02 0.77 0.51 .040 .030 .020 a1 standoff 5.08 4.57 4.06 .200 .180 .160 a top to seating plane 2.54 .100 p pitch 8 8 n number of pins max nom min max nom min dimension limits millimeters inches* units jedec equivalent: ms-030 drawing no. c04-010 *controlling parameter 1 2 d n e1 c eb e p l a2 b b1 a a1
tc4426/TC4427/tc4428 ds21422b-page 14 ? 2003 microchip technology inc. 8-lead plastic small outline (sn) ? narrow, 150 mil (soic) foot angle 048048 15 12 0 15 12 0 mold draft angle bottom 15 12 0 15 12 0 mold draft angle top 0.51 0.42 0.33 .020 .017 .013 b lead width 0.25 0.23 0.20 .010 .009 .008 c lead thickness 0.76 0.62 0.48 .030 .025 .019 l foot length 0.51 0.38 0.25 .020 .015 .010 h chamfer distance 5.00 4.90 4.80 .197 .193 .189 d overall length 3.99 3.91 3.71 .157 .154 .146 e1 molded package width 6.20 6.02 5.79 .244 .237 .228 e overall width 0.25 0.18 0.10 .010 .007 .004 a1 standoff 1.55 1.42 1.32 .061 .056 .052 a2 molded package thickness 1.75 1.55 1.35 .069 .061 .053 a overall height 1.27 .050 p pitch 8 8 n number of pins max nom min max nom min dimension limits millimeters inches* units 2 1 d n p b e e1 h l c 45 a2 a a1 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010? (0.254mm) per side. jedec equivalent: ms-012 drawing no. c04-057 significant characteristic
? 2003 microchip technology inc. ds21422b-page 15 tc4426/TC4427/tc4428 8-lead plastic micro small outline package (ms) (msop) d a a1 l c (f) a2 e1 e p b n 1 2 dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not .037 ref f footprint (reference) exceed .010" (0.254mm) per side. notes: drawing no. c04-111 *controlling parameter mold draft angle top mold draft angle bottom foot angle lead width lead thickness c b .003 .009 .006 .012 dimension limits overall height molded package thickness molded package width overall length foot length standoff overall width number of pins pitch a l e1 d a1 e a2 .016 .024 .118 bsc .118 bsc .000 .030 .193 typ. .033 min p n units .026 bsc nom 8 inches 0.95 ref - - .009 .016 0.08 0.22 0 0.23 0.40 8 millimeters* 0.65 bsc 0.85 3.00 bsc 3.00 bsc 0.60 4.90 bsc .043 .031 .037 .006 0.40 0.00 0.75 min max nom 1.10 0.80 0.15 0.95 max 8 -- - 15 5 - 15 5 - jedec equivalent: mo-187 0 - 8 5 5 - - 15 15 - - - -
tc4426/TC4427/tc4428 ds21422b-page 16 ? 2003 microchip technology inc. notes:
? 2003 microchip technology inc. ds21422b-page17 tc4426/TC4427/tc4428 product identification system to order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. sales and support data sheets products supported by a preliminary data sheet may have an errata sheet describing minor operational differences and recom- mended workarounds. to determine if an errata sheet exists for a particular device, please contact one of the following: 1. your local microchip sales office 2. the microchip corporate literature center u.s. fax: (480) 792-7277 3. the microchip worldwide site (www.microchip.com) please specify which device, revision of silicon and data sheet (include literature #) you are using. customer notification system register on our web site (www.microchip.com/cn) to receive the most current information on our products. part no. x /xx package temperature range device device: tc4426: 1.5a dual mosfet driver, inverting TC4427: 1.5a dual mosfet driver, non-inverting tc4428: 1.5a dual mosfet driver, complementary temperature range: c = 0c to +70c (pdip and soic only) e = -40c to +85c v = -40c to +125c m = -55c to +125c (cerdip only) package: ja = ceramic dual in-line (300 mil body), 8-lead oa = plastic soic, (150 mil body), 8-lead oa713 = plastic soic, (150 mil body), 8-lead (tape and reel) ua = plastic micro small outline (msop), 8-lead ua713 = plastic micro small outline (msop), 8-lead (tape and reel) pa = plastic dip (300 mil body), 8-lead examples: a) tc4426coa: 1.5a dual mosfet driver, soic package, 0c to +70c. b) tc4426eua: 1.5a dual mosfet driver, msop package, -40c to +85c. a) TC4427cpa: 1.5a dual mosfet driver, pdip package, 0c to +70c. b) TC4427epa: 1.5a dual mosfet driver, pdip package, -40c to +85c. a) tc4428mja: 1.5a dual mosfet driver, cdip package, -55c to +125c. b) tc4428coa713: 1.5a dual mosfet driver, tape and reel, soic package, 0c to +70c.
tc4426/TC4427/tc4428 ds21422b-page 18 ? 2003 microchip technology inc. notes:
? 2003 microchip technology inc. ds21422b-page 19 information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. no representation or warranty is given and no liability is assumed by microchip technology incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. use of microchip?s products as critical components in life support systems is not authorized except with express written approval by microchip. no licenses are conveyed, implicitly or otherwise, under any intellectual property rights. trademarks the microchip name and logo, the microchip logo, dspic, k ee l oq , mplab, pic, picmicro, picstart, pro mate and powersmart are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, micro id , mxdev, mxlab, picmaster, seeval and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. accuron, application maestro, dspicdem, dspicdem.net, economonitor, fansense, flexrom, fuzzylab, in- circuit serial programming, icsp, icepic, microport, migratable memory, mpasm, mplib, mplink, mpsim, picc, pickit, picdem, picdem.net, powercal, powerinfo, powermate, powertool, rflab, rfpic, select mode, smartsensor, smartshunt, smarttel and total endurance are trademarks of microchip technology incorporated in the u.s.a. and other countries. serialized quick turn programming (sqtp) is a service mark of microchip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2003, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. note the following details of the code protection feature on microchip devices: ? microchip products meet the specification contained in their particular microchip data sheet. ? microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip products in a manner outside the operating specifications contained in microchip's data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconductor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are committed to continuously improving the code protection features of our products. attempts to break microchip?s code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received qs-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona in july 1999 and mountain view, california in march 2002. the company?s quality system processes and procedures are qs-9000 compliant for its picmicro ? 8-bit mcus, k ee l oq ? code hopping devices, serial eeproms, microperipherals, non-volatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001 certified.
ds21422b-page 20 ? 2003 microchip technology inc. m americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: 480-792-7627 web address: http://www.microchip.com atlanta 3780 mansell road, suite 130 alpharetta, ga 30022 tel: 770-640-0034 fax: 770-640-0307 boston 2 lan drive, suite 120 westford, ma 01886 tel: 978-692-3848 fax: 978-692-3821 chicago 333 pierce road, suite 180 itasca, il 60143 tel: 630-285-0071 fax: 630-285-0075 dallas 4570 westgrove drive, suite 160 addison, tx 75001 tel: 972-818-7423 fax: 972-818-2924 detroit tri-atria office building 32255 northwestern highway, suite 190 farmington hills, mi 48334 tel: 248-538-2250 fax: 248-538-2260 kokomo 2767 s. albright road kokomo, in 46902 tel: 765-864-8360 fax: 765-864-8387 los angeles 18201 von karman, suite 1090 irvine, ca 92612 tel: 949-263-1888 fax: 949-263-1338 phoenix 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7966 fax: 480-792-4338 san jose 2107 north first street, suite 590 san jose, ca 95131 tel: 408-436-7950 fax: 408-436-7955 toronto 6285 northam drive, suite 108 mississauga, ontario l4v 1x5, canada tel: 905-673-0699 fax: 905-673-6509 asia/pacific australia suite 22, 41 rawson street epping 2121, nsw australia tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing unit 915 bei hai wan tai bldg. no. 6 chaoyangmen beidajie beijing, 100027, no. china tel: 86-10-85282100 fax: 86-10-85282104 china - chengdu rm. 2401-2402, 24th floor, ming xing financial tower no. 88 tidu street chengdu 610016, china tel: 86-28-86766200 fax: 86-28-86766599 china - fuzhou unit 28f, world trade plaza no. 71 wusi road fuzhou 350001, china tel: 86-591-7503506 fax: 86-591-7503521 china - hong kong sar unit 901-6, tower 2, metroplaza 223 hing fong road kwai fong, n.t., hong kong tel: 852-2401-1200 fax: 852-2401-3431 china - shanghai room 701, bldg. b far east international plaza no. 317 xian xia road shanghai, 200051 tel: 86-21-6275-5700 fax: 86-21-6275-5060 china - shenzhen rm. 1812, 18/f, building a, united plaza no. 5022 binhe road, futian district shenzhen 518033, china tel: 86-755-82901380 fax: 86-755-8295-1393 china - shunde room 401, hongjian building no. 2 fengxiangnan road, ronggui town shunde city, guangdong 528303, china tel: 86-765-8395507 fax: 86-765-8395571 china - qingdao rm. b505a, fullhope plaza, no. 12 hong kong central rd. qingdao 266071, china tel: 86-532-5027355 fax: 86-532-5027205 india divyasree chambers 1 floor, wing a (a3/a4) no. 11, o?shaugnessey road bangalore, 560 025, india tel: 91-80-2290061 fax: 91-80-2290062 japan benex s-1 6f 3-18-20, shinyokohama kohoku-ku, yokohama-shi kanagawa, 222-0033, japan tel: 81-45-471- 6166 fax: 81-45-471-6122 korea 168-1, youngbo bldg. 3 floor samsung-dong, kangnam-ku seoul, korea 135-882 tel: 82-2-554-7200 fax: 82-2-558-5932 or 82-2-558-5934 singapore 200 middle road #07-02 prime centre singapore, 188980 tel: 65-6334-8870 fax: 65-6334-8850 taiwan kaohsiung branch 30f - 1 no. 8 min chuan 2nd road kaohsiung 806, taiwan tel: 886-7-536-4818 fax: 886-7-536-4803 taiwan taiwan branch 11f-3, no. 207 tung hua north road taipei, 105, taiwan tel: 886-2-2717-7175 fax: 886-2-2545-0139 europe austria durisolstrasse 2 a-4600 wels austria tel: 43-7242-2244-399 fax: 43-7242-2244-393 denmark regus business centre lautrup hoj 1-3 ballerup dk-2750 denmark tel: 45-4420-9895 fax: 45-4420-9910 france parc d?activite du moulin de massy 43 rue du saule trapu batiment a - ler etage 91300 massy, france tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany steinheilstrasse 10 d-85737 ismaning, germany tel: 49-89-627-144-0 fax: 49-89-627-144-44 italy via quasimodo, 12 20025 legnano (mi) milan, italy tel: 39-0331-742611 fax: 39-0331-466781 netherlands p. a. de biesbosch 14 nl-5152 sc drunen, netherlands tel: 31-416-690399 fax: 31-416-690340 united kingdom 505 eskdale road winnersh triangle wokingham berkshire, england rg41 5tu tel: 44-118-921-5869 fax: 44-118-921-5820 07/28/03 w orldwide s ales and s ervice


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